Semicon 2.0 is aimed at holistically building the semiconductor ecosystem on the following six pillars:

• First Pillar: Deepening Chip Design: Moving 105+ active startups from prototyping to commercial deployment. Focuses heavily on developing native Indian Intellectual Property (IP) and system architectures for both strategic and commercial use.
• Second Pillar: Machines & Materials: Filling a critical upstream supply chain gap. Incentivizes the domestic manufacturing and research of chip-making equipment, specialized chemicals, high-purity gases, and raw substrates.
• Third Pillar: Setting Up More Fabs: Accelerating capital investments to attract further commercial Silicon Fabs, Compound Semiconductor units, discrete component fabs, and display manufacturing plants.
• Fourth Pillar: Advanced ATMP / OSAT: Upgrading Assembly, Testing, Marking, and Packaging capabilities. The focus shifts toward attracting the world’s most advanced packaging technologies (such as 3D heterogeneous packaging).
• Fifth Pillar: Research & Development: Moving beyond basic nodes (28nm–110nm) toward a defined technological roadmap for sub-7nm, 3nm, and 2nm nodes in active collaboration with global R&D institutions.
• Sixth Pillar: Talent Development: Expanding training across 315 universities equipped with advanced Electronic Design Automation (EDA) software. Deepens field curriculum into cleanroom engineering, fab construction, and high-level circuit architecture.

Source: PIB